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Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition

Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition

  • ItemNo :

    Lith-PD-400C
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition



Model:  PD-400C-Multi-target For Multilayer Films Deposition


Product Overview

The PD-400C magnetron sputtering system is designed for scientific research institutions and university laboratories. Featuring core components system offers stable performance, high automation, and serves as a competitive alternative to imported equipment.


Key Features

1. Versatile Sputtering Modes

·Compatible with both DC and RF sputtering sources, enabling deposition of metallic, non-metallic, and compound thin films.

·Supports multi-layer and composite film deposition for advanced material research.

2. Superior Film Quality

·Delivers excellent uniformity (±3%~5%) and repeatability for metals, semiconductors, and insulating materials.

3. Optimized Configuration

·Equipped with three 3-inch circular target guns, mounted in a co-focal upward sputtering arrangement.

·Adjustable sputtering area: 2–4 inches (compatible with 2–3 inch targets).


Technical Specifications

Parameter

Value / Description

System Dimensions (L×W×H)

850 × 1100 × 1900 mm

Chamber Dimensions (L×W×H)

400 × 400 × 380 mm

Substrate Stage

Max temperature: 600°C (±5°C accuracy)

Ultimate Vacuum

≤ 5 × 10−5 Pa

Pump-down & Holding

≤ 8 × 104 Pa in 30 min; ≤ 8 Pa over 12 hours

Uniformity

Better than ±3%–5%

Target Configuration

3 guns (2–3 inch), 2–4 inch deposition area


Application Scope

The PD-400C is ideal for depositing nitrides, oxides, and other functional films, catering to:

· Semiconductor research (e.g., conductive/dielectric layers).

· Optical coatings (anti-reflective, protective films).

· Advanced materials (multilayer structures, composite films).

Installation Notes

1. Leveling: Ensure absolute horizontal alignment using a spirit level to guarantee film uniformity.

2. Connections: Securely attach power, cooling water, and vacuum pipelines, checking all seals for leaks.

3. Inspection: Verify no physical damage occurred during transit.


Working Principle

The system utilizes glow discharge of inert gases to generate ionized particles. These particles bombard the target surface, ejecting atoms/molecules that condense on the substrate to form thin films. Secondary electrons sustain plasma, enhancing deposition efficiency.

Why Choose PD-400C?

· Reliability: Premium components ensure long-term stability.

· Flexibility: Dual-mode sputtering for diverse materials.

· Precision: Tight temperature/vacuum control for reproducible results.


Magnetron Sputtering

Versatile Magnetron Sputtering

Multilayer Films Deposition







PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity