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RF&DC&MF Dual-Target PVD Sputtering Coating Euipment For Conductive Multilayer Films

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
RF&DC&MF Dual-Target PVD Sputtering Coating Euipment For Conductive Multilayer Films

RF&DC&MF Dual-Target PVD Sputtering Coating Euipment For Conductive Multilayer Films

  • ItemNo :

    Lith-CK300-05
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

RF&DC&MF Dual-Target PVD Sputtering Coating Euipment For Conductive Multilayer Films



Model: CK300-05-RF&DC&MF for Conductive Multilayer Films


Technical Parameters

No.

Parameter

Specification

1

Sputtering Chamber Ultimate Vacuum

≤6.6×10⁻⁶ Pa

2

System Leak Rate

≤5.0×10⁻⁷ Pa·L/S

3

Pump-Down Time (from atmosphere)

≤30 min to 6.6×10⁻⁴ Pa

4

Vacuum Retention (12h after shutdown)

≤5 Pa

5

Sputtering Chamber Dimensions

≥Ø300 mm × 300 mm

6

Magnetron Sputtering Targets

2 × 50 mm (RF/DC/MF compatible, adjustable)

7

Power Supplies

1 × 500W DC, 1 × 500W RF (auto-matching)

8

Film Uniformity

≤5%

9

Substrate Holder Rotation

0–30 RPM (adjustable)

10

Substrate Heating Range

RT–600°C (PID-controlled)

11

Gas Control

100 SCCM MFC, CF16/DN16 valves

12

Turbo Molecular Pump Speed

300 L/s

13

Mechanical Pump Speed

4 L/s

14

Vacuum Measurement

INFICON gauge

15

Control System

PLC + Industrial PC + Touchscreen (full automation)


Key Features & Applications

1. Dual-Target Flexibility

·Supports multi-layer or composite film deposition (e.g., conductive/insulating stacks).

·RF/DC/MF compatibility enables processing of magnetic materials.

2. High Vacuum Performance

·Ultra-low base pressure (≤6.6×10⁻⁶ Pa) minimizes contamination for high-purity films.

·Fast pump-down and excellent vacuum retention reduce downtime.

3. Precision Process Control

·PID-controlled heating (RT–600°C) for annealing or stress management.

·Automated gas flow (MFC) and power adjustment for reproducible results.

4. User-Centric Design

·Rotating substrate holder ensures uniform coating (≤5% non-uniformity).

·Touchscreen + PLC automation simplifies operation and reduces human error.

5. Compact & Mobile

·Lockable wheeled frame suits lab environments with space constraints.

Ideal For:

· Research: Thin-film studies (semiconductors, optics, tribology).

· Industry: Functional coatings (wear-resistant, decorative, or barrier films).

· Magnetic Materials: Sputtering of Fe, Co, Ni alloys or oxides.

 Conductive Multilayer Films




PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity