High Vacuum Magnetron Sputtering Deposition PVD System For Multilayer & Multitarget

ItemNo :
Lith-CK450B
MOQ :
1
Compliance:
CE Certified
Warranty:
1 year
Delivery Time:
5 days
Email :
Louis@lithmachine.com

Contact Now

Product Details

High Vacuum Magnetron Sputtering Deposition PVD System For Multilayer & Multitarget

*Model: CK450B-High Vacuum & Multilayer & Multitarget***

Key Features & Applications

The CK450B is designed for nano-scale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor layers, and dielectric films. Ideal for research institutions and universities, it supports both material science studies and small-batch production.

System Components

· Vacuum chamber system (sputtering chamber)

· Target & power supply system

· Sample stage system

· Vacuum pumping & measurement system

· Gas flow system

· Control system

· Film thickness monitoring system

· Top cover lifting mechanism

· Electrical control system

· Computer-controlled system & auxiliary components

Technical Specifications

Parameter

Value

Ultimate Vacuum

6.7×10^-5 Pa

System Leak Rate

1×10^-7 Pa·L/S

Vacuum Recovery Time

≤40 min to 6.6×10 Pa (after N² purge)

Chamber Design

Round chamber, Ø450×350 mm

Sample Stage

3-inch × 3-inch (3.2 mm thick)

Heating Temperature

600°C ±1°C (programmable)

Sample Rotation

Self-rotation: 0–50 RPM (uniformity)

Revolution: Position-switching capability

Magnetron Target

3 targets (standard)

Effective Sputtering Area: 3-inch × 3-inch

Type: Permanent magnet, brazed indirect water-cooled

Deposition Mode

Upward sputtering (planar target)

Substrate Bias Voltage

Up to –200 V

Gas Flow System

2-channel mass flow controller

Thickness Monitor

Quartz crystal sensor (0–999,999 Å)

Pumping Options

Turbo molecular pump / Cryogenic pump + Dry scroll pump

Control & Automation

· Real-time monitoring: Tracks displacement and revolution speed.

· Error analysis: Displays deviations via curves/numerical data.

· Flexible display: Switch between linear and logarithmic scales for revolution speed vs. displacement.

· Advanced modes: Supports fixed-point deposition and resistive evaporation coating.

Why Choose CK450B?

✔ High Precision: Programmable heating (±1°C) and dual-axis sample motion ensure uniform film growth.
✔ Versatile Configurations: Compatible with multiple target materials and pumping systems.
✔ Research-Oriented: Combines in-situ thickness control with automated process logging for reproducible results.

Ideal for: Advanced material research, optical coatings, semiconductor layers, and protective coatings development.

PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity

HotTags : PVD System Multilayer Films Deposition Multitarget Coating System High Vacuum Deposition High Vacuum PVD Sputtering System

Parameter	Value
Ultimate Vacuum	6.7×10^-5 Pa
System Leak Rate	1×10^-7 Pa·L/S
Vacuum Recovery Time	≤40 min to 6.6×10 Pa (after N² purge)
Chamber Design	Round chamber, Ø450×350 mm
Sample Stage	3-inch × 3-inch (3.2 mm thick)
Heating Temperature	600°C ±1°C (programmable)
Sample Rotation	Self-rotation: 0–50 RPM (uniformity) Revolution: Position-switching capability
Magnetron Target	3 targets (standard) Effective Sputtering Area: 3-inch × 3-inch Type: Permanent magnet, brazed indirect water-cooled
Deposition Mode	Upward sputtering (planar target)
Substrate Bias Voltage	Up to –200 V
Gas Flow System	2-channel mass flow controller
Thickness Monitor	Quartz crystal sensor (0–999,999 Å)
Pumping Options	Turbo molecular pump / Cryogenic pump + Dry scroll pump