Email:Louis@lithmachine.com
ItemNo :
Lith-CK300-05MOQ :
1Compliance:
CE CertifiedWarranty:
1 yearDelivery Time:
5 daysEmail :
Louis@lithmachine.com
Model: CK300-05-4-Target Multi-Mode Sputtering (DC + RF + Strong Magnetic Field)
|
Category |
Specification |
|
Chamber Structure |
Horizontal design, electric lift-off top cover, stainless steel/vacuum materials |
|
Base Vacuum |
≤5×10⁻⁵ Pa |
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Working Vacuum |
≤5×10⁻⁴ Pa (achieved in 100 min after pump-down) |
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Leak Rate |
≤5×10⁻⁷ Pa·L/s |
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Pressure Rise Rate |
≤10 Pa (after 12 h shutdown) |
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Pumping System |
Domestic molecular pump + mechanical pump |
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Target Configuration |
4 × 6-inch targets (3 standard-field, 1 strong-field); DC/RF, max 5,000 W |
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Target-Substrate Distance |
40–120 mm (adjustable) |
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Substrate Heating |
Max 400°C, programmable rate/dwell time |
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Film Thickness Uniformity |
≤5% (2-inch area; Cu/Al: 4–5 µm; Ni/PTFE: 1–2 µm) |
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Adhesion Standard |
Passes 3× tape peel tests (glass/Si/ceramic substrates) |
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Pre-Cleaning |
Reverse sputtering capability |
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Ion Source |
Anode-layer ion source (cleaning + assisted deposition) |
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Gas Control |
2 MKS mass flow controllers (reactive/Ar gases), mixing/pressure adjustment |
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Baking Temperature |
150°C (infrared heating) |
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Safety Protections |
Water/power failure interlock, anti-misoperation design |
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Automation |
PC-controlled (target switching, rotation, temperature, shutters) |
· Nanoscale control: Achieves ≤5% thickness uniformity for functional films (e.g., semiconductors, hard coatings).
· Multi-material flexibility: Simultaneously supports metals (Cu/Al), dielectrics (PTFE), and compounds via 4 targets.
· Ion-assisted deposition improves film adhesion and density.
· Pre-sputtering cleaning ensures contamination-free substrates.
· Automated PC control simplifies complex processes (e.g., multilayer deposition).
· Horizontal chamber design enables quick sample loading.
· R&D labs: Ideal for prototyping optical, electronic, or wear-resistant coatings.
· Small-batch production: Reliable for precision coatings in aerospace or semiconductor sectors.
· Liner plates protect chamber walls, reducing maintenance downtime.
· Interlocks prevent damage from operational errors.
Summary: The CK800 excels in high-repeatability, multi-material deposition, and automation, catering to both cutting-edge research and specialized industrial coating needs.
· Unique Feature: Only system in its class offering 3 standard-field targets + 1 strong-field target in a compact design.
· Competitor Comparison: Most systems provide only DC or RF targets separately, limiting material compatibility.
· Client Benefit: Enables simultaneous deposition of metals, insulators, and alloys (e.g., Cu+Al₂O₃+Ni) without breaking vacuum.
· Unique Feature: Patented bypass pumping + dry nitrogen venting reduces pump-down time by 40% vs. industry average.
· Competitor Comparison: Comparable systems often require 3+ hours to reach working vacuum after venting.
· Client Benefit: Dramatically improves throughput for batch processing (e.g., 8–10 runs/day vs. 4–5 with competitors).
· Unique Feature: Built-in anode-layer ion source for in-situ cleaning + energy-enhanced deposition.
· Competitor Comparison: Most systems require external ion guns (added cost/complexity).
· Client Benefit: Achieves >2x better adhesion (passes 10+ tape tests vs. industry-standard 3) and denser films for optical/barrier coatings.
PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.
DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity
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Louis@lithmachine.com
+0086 15959378975
