Email:Louis@lithmachine.com
ItemNo :
Lith-CK300-07MOQ :
1Compliance:
CE CertifiedWarranty:
1 yearDelivery Time:
5 daysEmail :
Louis@lithmachine.com
Model: CK300-07- Versatile Magnetron Sputtering System For Functional Film Deposition Coating
Application:
Designed for the preparation of nanoscale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor films, and dielectric films. It is widely suitable for scientific research and small-batch production in universities and research institutes. Equipped with an anode-layer ion source for pre-cleaning and assisted deposition, as well as a reverse sputtering function to enhance film quality and adhesion.
System Configuration:
The system consists of a sputtering vacuum chamber, permanent magnet sputtering targets (3 targets), a single-substrate heating stage, DC/RF power supplies, gas supply system, pumping system, vacuum measurement, electrical control system, and mounting platform.
|
Parameter |
Specification |
|
Chamber Structure |
Vertical, top-loading; stainless steel & vacuum-compatible materials |
|
Base Pressure (Sputtering Chamber) |
≤5×10⁻⁶ Pa |
|
Leak Rate |
≤5×10⁻⁷ Pa·L/s |
|
Pressure Rise Rate |
≤1 Pa (after 12 hours of pump shutdown) |
|
Pumping System |
Domestic molecular pump + mechanical pump |
|
Magnetron Targets |
3 × 3-inch HV-compatible (2 standard field, 1 strong field) |
|
Power Supplies |
RF: 600 W, 13.56 MHz (auto-matching); DC: 2 × 1000 W |
|
Target-Substrate Distance |
40–120 mm (adjustable) |
|
Substrate Heating |
Max 450°C, programmable control |
|
Film Thickness |
Cu/Al: 4–5 μm; Ni/PTFE: 1–2 μm |
|
Uniformity (2-inch area) |
≤5% deviation |
|
Adhesion Test |
Withstands 3 tape-peeling tests (glass/si/ceramic) |
|
Pre-Cleaning |
Reverse sputtering capability |
|
Ion Source |
Anode-layer for cleaning & assisted deposition |
|
Gas Control |
2 MKS mass flow controllers (reactive/Ar); gas mixing |
|
Baking Temperature |
150°C (infrared heating) |
|
Safety Features |
Water/power failure interlock; anti-misoperation |
1. Precision Deposition
·Supports DC/RF sputtering for diverse materials (metals, semiconductors, dielectrics).
·Ion-assisted deposition enhances film density and adhesion.
2. High Vacuum Stability
·Ultra-low base pressure (≤5×10⁻⁶ Pa) ensures contamination-free films.
·Low leak rate maintains consistent process conditions.
3. User-Centric Design
·Vertical loading simplifies sample handling.
·Programmable substrate heating (up to 450°C) for optimized film growth.
4. Quality Assurance
·≤5% thickness uniformity and rigorous adhesion standards (tape test).
·Reverse sputtering and ion source for pre-deposition cleaning.
5. Research & Small-Batch Production
·Ideal for universities, labs, and industrial R&D in optics, electronics, and coatings.
PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.
DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity
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