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Nano Thin Film Evaporation Evaporator For Metals, Alloys & Dielectric Film Deposition

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Nano Thin Film Evaporation Evaporator For Metals, Alloys & Dielectric Film Deposition

Nano Thin Film Evaporation Evaporator For Metals, Alloys & Dielectric Film Deposition

  • Product Details

Nano Thin Film Evaporation Evaporator For Metals, Alloys & Dielectric Film Deposition



Lith-PC-DZ03-Electron Beam Evaporation Coating System


Key Applications

Designed for the deposition of conductive films, semiconductor films, ferroelectric films, and optical coatings, this system is widely utilized in university laboratories, research institutions, and small-scale production environments requiring high-precision thin-film fabrication.


System Components

· Deposition Chamber: U-shaped design with front-loading door, dimensions: 800 × 600 × 600 mm.

· E-Gun Electron Beam Source:

o Anode voltage: 8 kV / 10 kV (1 set included).

o Power range: 0–10 kW (adjustable).

· Crucible: Water-cooled, 6-pocket design (11 mL per pocket).

· Resistive Evaporation Source (Optional):

o Voltage: 5 V / 10 V.

o Power: 300 A current, max. 3 kW output (1 set).

o Configurable with 3 water-cooled electrodes to form 2 evaporation boats.

· Substrate Holder:

o Accommodates up to 4″ substrates.

o Rotational speed: 5–60 RPM (continuously adjustable).

o Substrate-to-source distance: 300–350 mm.

o Heating range: up to 800°C ±1°C (manual control).

o Includes a manual sample shutter assembly.

· Gas Delivery System: 1-channel mass flow controller (MFC).

· Vacuum System:

o Base pressure: ≤6.7 × 10–4 Pa.

o Pump-down time: ≤20 min (from 1 × 10–1 Pa to 5 × 10–4 Pa).

o Leak rate: ≤6.7 × 10–7 Pa·L/s.

· Thickness Monitoring: Quartz crystal microbalance (QCM) with display range: 0–99,999 Å.


Technical Advantages

1. Precision Control: Adjustable e-beam power and substrate rotation ensure uniform film thickness and composition.

2. Versatility: Compatible with multiple evaporation sources (e-beam + resistive), enabling deposition of diverse materials.

3. High-Temperature Stability: Substrate heating up to 800°C (±1°C) supports annealing and epitaxial growth.

4. Efficient Vacuum Performance: Rapid pump-down and low leak rate enhance process reproducibility.

5. User-Friendly Design: Front-loading chamber and modular components simplify maintenance and sample handling.


Target Industries & Research Fields

· Advanced Materials: Optoelectronics, MEMS, superconducting films.

· Energy Applications: Thin-film solar cells, battery electrodes.

· Academic Research: Surface science, nanotechnology, and condensed matter physics.

Metals Evaporator





PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity