ItemNo :
Lith-TK-DZ02MOQ :
1Compliance:
CE CertifiedWarranty:
1 yearDelivery Time:
5 days
High Vacuum Electron Beam Evaporation Coating System For Layer Deposition In OLED, Solar Cell & Semiconductor
Lith-TK-DZ02-Precision Thin-Film Deposition Solution for Research & Industry
The Lith-TK-DZ02 is a high-performance electron beam evaporation system designed for advanced thin-film research and small-batch production. Featuring a compact vertical design with semi-automatic controls, it offers exceptional film uniformity and material versatility for both academic and industrial applications.
· Achieves ≤±5% film thickness uniformity via rotating substrate holder (0-40 rpm)
· Ultra-high vacuum (6.0×10⁻⁵ Pa) ensures minimal contamination
· Fast pumping system reaches working vacuum in ≤30 minutes
· 8kW E-gun with 6-crucible carousel (domestic/import options)
· Optional Kaufman ion source for improved film density and adhesion
· Triple resistive evaporation sources for low-temperature materials
· PLC + touchscreen control for reproducible processes
· Compact footprint (2.5×1.6m) ideal for laboratory environments
· Comprehensive safety protection system (cooling/voltage/pressure monitoring)
|
Parameter |
Specification |
|
Chamber Design |
Vertical cylinder, side-opening |
|
Chamber Dimensions |
Φ500 × H650 mm |
|
Base Pressure |
≤6.0×10⁻⁵ Pa |
|
Pumping Speed |
2000 L/s |
|
Heating Temperature |
RT - 300°C (substrate) |
|
Substrate Stage |
Φ200 mm rotating (max Φ300 mm loading) |
|
Film Uniformity |
≤±5% |
|
E-Gun Power |
8 kW |
|
Control System |
PLC + Touchscreen |
|
Total Power Consumption |
≥17 kW |
· Anti-reflection coatings
· Laser optics
· IR filters and mirrors
· Conductive films (Au, ITO)
· Dielectric layers (SiO₂, Al₂O₃)
· Semiconductor device fabrication
· Ferroelectric films (PZT)
· MEMS and sensor coatings
· Wear/corrosion resistant layers
· Processes metals (Al, Au, Ti), oxides (SiO₂), and organic films
· Handles both low-vapor-pressure and refractory materials
· Supports multi-layer deposition for complex structures
· Substrate heating enables optimized film crystallization
· Robust mechanical design for continuous operation
· Low maintenance requirements with easy consumable replacement
· Academic/Industrial Versatility: From basic research to pilot production
· Cost Efficiency: Lower operational costs than comparable systems
· Future Expandability: Modular design accepts process upgrades
PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.
DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity
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