ItemNo :
Lith-ZY-DZ01MOQ :
1Compliance:
CE CertifiedWarranty:
1 yearDelivery Time:
5 days
High Vacuum Glovebox Multi-Material Evaporator Machine For Metals, Alloys & Dielectric Film
Lith-ZY-DZ01-Advanced Thin-Film Deposition System
The Lith-ZY-DZ01 Electron Beam Evaporation Coating System integrates a cryogenic pump vacuum assembly to deposit thin films via electron beam bombardment in a high-vacuum environment. Equipped with 6 electron beam evaporation sources, 2 resistive thermal evaporation sources, and a precision deposition control system, it enables rapid multilayer metal/alloy film deposition. Ideal for semiconductor fabrication, advanced research, and new material development.
✔ Scientific Research – High-precision thin-film deposition for experimental studies.
✔ Semiconductor Wafer Processing – Uniform coatings for microelectronics and MEMS devices.
✔ Optical Thin-Film Components – Low-defect films for lenses, filters, and laser optics.
✔ Nano/Microelectronic Devices – Ultra-thin, controlled-thickness coatings for advanced electronics.
· Modular design allows tailored configurations (e.g., additional evaporation sources).
· Dual evaporation modes (E-beam + resistive thermal) support diverse materials (metals, alloys, organics).
· Cryo-Torr 8 (1500L/s) + dry scroll pump achieves <5×10⁻⁶ Pa base pressure (≤35 min pumping time).
· VAT ISO-F200 high-vacuum valve ensures pressure stability and cryopump isolation.
· INFICON IC6 quartz crystal monitor (0.01 Å/s resolution) with dual water-cooled sensors.
· Planetary substrate rotation (0–30 RPM) ensures ≤2% thickness uniformity.
· 3 IR heaters (RT–300°C ±0.5°C) and PID-controlled cooling for thermal management.
· 3 independent substrate holders (max. 250 mm × 3) enable batch processing.
· PC+PLC+FTM control software supports 99-layer programmable recipes, real-time editing, and data export.
· Telemark E-beam sources (6×7 cc crucibles, 10 kV/800 mA) ensure stable, contamination-free deposition.
· Multi-interlock protection (cooling/pressure/power failure/leak detection).
|
Category |
Parameter |
|
Vacuum System |
Base pressure: ≤6×10⁻⁸ Torr; Leak rate ≤5×10⁻⁹ Pa·L/s |
|
Deposition Rate |
≥10 nm/min (material-dependent) |
|
E-Beam Sources |
6×7 cc crucibles; 10 kV, 800 mA (Telemark 244-9906-1) |
|
Resistive Sources |
2×100 mm boats; 6–10 V, 400 A (water-cooled) |
|
Max. Coating Layers |
99 |
|
Substrate Capacity |
3×250 mm (rotating planetary holders) |
|
Chamber Dimensions |
Φ600 mm × 690 mm (h); detachable liner |
|
Cooling System |
3 water circuits (8 L/min, 15–25°C) |
|
Power Requirements |
AC 230 V, 32 A, 50 Hz |
|
Dimensions/Weight |
1750×1150×2000 mm (H); 650 kg |
· Temperature: 23±3°C
· Humidity: <60% RH
· Cooling Water: 0.2 MPa, ≥8 L/min
· Compressed Gas: 0.5 MPa, 80 L/min (if applicable)
· Research-Grade Precision: Combines high vacuum stability with sub-nanometer thickness control.
· Multi-Material Compatibility: Handles metals (Al, Au, Ti), oxides, and organic compounds.
· Scalability: Suitable for R&D prototyping and small-batch production.
· User-Centric Design: Automated workflows reduce manual intervention while allowing parameter flexibility.
Ideal for: Universities, semiconductor labs, and optoelectronics manufacturers seeking repeatable, high-quality thin films with minimal downtime.
PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.
DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity
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