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Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition

Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition

  • ItemNo :

    Lith-JCP350
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition



Model: JCP-Multilayer Thin Film Fabrication


Application Fields

Electronics/Batteries, Steel/Metals, Aerospace, Automotive & Components, Electrical Industries


Product Features & Applications

► Dual-functionality: Supports both sputtering and evaporation processes. Compact footprint, cost-effective, stable performance, and low maintenance.
► Versatile coating capabilities: Deposits single/multi-layer films including metal films (Ag, Al, Cu, Ni, Cr, NiCr alloys), dielectric films (TiO₂, SiO₂), semiconductor films (ITO), magnetic filmsheat-resistant alloys, and corrosion-resistant/ hard coatings.
► Flexible configurations: Single-target, sequential multi-target, or co-sputtering modes for multilayer/composite films.


Technical Specifications

Parameter

Specification

Model

JCP350

Chamber Structure

Vertical top-opening, rear-mounted pumping system, pneumatic lift

Chamber Dimensions

Φ350 × H350 mm

Heating Temperature

Room temp. ~ 500°C

Sputtering Mode

Upward sputtering

Substrate Stage

Rotating, Φ120 mm

Film Uniformity

≤±5.0% (Φ75 mm area)

Targets

2× Φ2" magnetron targets (DC/RF compatible)

Gas Control

2–3 channels MFC

Control System

PLC + touchscreen (semi-automatic)

Footprint (Main Unit)

L1600 × W800 × H1920 mm

Power Consumption

≥8 kW


Key Performance Metrics

1. Vacuum System:

·Pumps: Compound molecular pump + rotary vane pump, with electric/gas valves.

·Base Pressure: ≤6.6×10⁻⁵ Pa (after 24h pumping).

·Leak Rate: ≤0.8 Pa/h.

·Pump-down Time: ≤15 min (to 5.0×10⁻³ Pa, empty chamber).

2. Substrate Handling:

·Rotation: 0–20 rpm.

·Heating: RT ~ 500±1°C.

3. Target Configuration:

·3× Φ2" magnetron targets (coaxial sputtering).

·Includes DC (2 units) + RF (1 unit) power supplies, with pneumatic shutters.

4. Safety & Control:

·Protections: Overcurrent/voltage, water cooling faults, and interlock system.

·Noise Level: ≤70 dB.


Unique Advantages & Target Users

· Research & Production Flexibility: Ideal for nano-scale conductive/magnetic films (Ni, Co), semiconductor layers (ITO, ZnO), and ceramic insulating films.

· Multi-target Synergy: Independent/sequential/co-sputtering modes enable complex multilayer structures.

· User-Friendly: PLC+touchscreen control suits academic labsR&D centers, and industrial production.

Ideal For: Universities, research institutes, and manufacturers requiring high-precisionrepeatable thin-film deposition for advanced materials.

PVD Magnetron Sputtering

PVD System




PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity