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DC/RF Nano High-Precision Sputtering Coater Film Deposition System With Rotatable Triple-targets

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
DC/RF Nano High-Precision Sputtering Coater Film Deposition System With Rotatable Triple-targets

DC/RF Nano High-Precision Sputtering Coater Film Deposition System With Rotatable Triple-targets

  • ItemNo :

    Lith-CK350
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

DC/RF Nano High-Precision Sputtering Coater Film Deposition System With Rotatable Triple-targets 



Model: CK350-Rotatable Triple-targets 


Technical Specifications

Category

Parameter

Value/Description

Chamber Structure

Design

Vertical front-loading, stainless steel

 

Sample Access

Easy loading/unloading

Vacuum Performance

Base Pressure

≤5×10−5 Pa

 

Leak Rate

≤5×10−7 Pa·L/s

 

Pressure Rise Rate (12h)

≤10 Pa

 

Pumping System

Domestic molecular pump + mechanical pump

Targets & Power Supplies

Target Quantity & Size

3 × 2-inch magnetron targets (HV compatible)

 

Target Types

1 × Standard magnetic field, 1 × Strong magnetic field

 

Target-Substrate Distance (Multilayer)

40–120 mm

 

Target-Substrate Distance (Ion Source)

80–120 mm

 

RF Power Supply

1 × 1000 W, 13.56 MHz (auto-matching)

 

DC Power Supply

2 × 1000 W

Substrate Holder

Capacity

Up to 3 substrates

 

Rotation Speed

5–30 RPM (self-rotation + planetary)

 

Heating Range

Programmable up to 450°C

 

Bias Voltage

Supports up to 1000 V

Gas Control System

Gas Lines

2 independent MKS mass flow controllers (Ar + reactive gas)

 

Features

Gas mixing, adjustable/measurable chamber pressure

Additional Features

Chamber Baking

Infrared heating (150°C)

 

Liner Plate

Prevents chamber contamination

 

Safety Protections

Water/power failure interlock, anti-misoperation protection


Key Features & Applications

1. Advanced Deposition Capabilities

· Supports DC/RF sputtering for metals, semiconductors, and insulators.

· Triple-target design enables sequential multilayer deposition without vacuum breaks.

2. Precision Process Control

· Programmable substrate heating (±450°C) with adjustable ramp rates.

· Rotation mechanism (5–30 RPM) ensures uniform film thickness.

3. Research & Small-Batch Flexibility

· Ideal for nanoscale functional films (e.g., optoelectronics, tribological coatings).

· Reverse sputtering cleaning enhances film adhesion and purity.

4. User-Centric Design

· Manual controls for target shutters, rotation, and temperature.

· Safety systems mitigate operational risks (e.g., interlock protections).


Target Users

· Academic & Government Labs: Thin-film material R&D.

· Industrial Prototyping: Small-scale production of specialized coatings.


 Sputtering Coater





PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity