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Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors

Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors

  • ItemNo :

    Lith-PD-200C
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

Benchtop DC/RF Magnetron Sputtering Conductive Coater For Metals, Oxides & Ceramics & Semiconductors



Model:  PD-200C-DC/RF Sputtering, Multi-Target, Uniform Coating (±5%), Fast Deposition


Product Overview

The PD-200C is a compact magnetron sputtering system designed for laboratory-scale thin-film deposition. Compatible with both DC and RF sputtering sources, it supports the coating of metals, non-metals, and compound films (e.g., ITO). Ideal for academic and industrial research, it enables the preparation of single/multilayer films and facilitates advanced material/process development.


Key Features

1. Robust Construction

·All-stainless-steel vacuum chamber ensures durability and operational safety.

·Optimized gas path design for enhanced process control.

2. Space-Efficient & Modular

·Compact footprint (500×360×380mm) with modular expandability, maximizing lab space utilization.

3. High-Efficiency Vacuum System

·Hybrid mechanical + imported molecular pump achieves high vacuum (≤3×10⁻⁵ Pa) in 15–20 minutes, reducing downtime.

4. Precision Process Control

·Uniformity: ≤±5% over Ø80mm substrate area.

·Rotating Substrate Holder: Adjustable speed (0–20 RPM) with magnetic fluid sealing for stable deposition.

5. Flexible Configuration

·Sputtering Sources: 2–3 × 2-inch targets (DC/mid-frequency/RF).

·Gas System: 1–3 gas inlets with ±1% flow accuracy (20 sccm).


Technical Specifications

Parameter

Specification

Vacuum Chamber

Ø260 × H280mm (304 stainless steel, cylindrical, viewport)

Vacuum System

Mechanical pump + imported molecular pump

Base Pressure

≤3×10⁻⁵ Pa

Pump-down Time

≤3×10⁻⁴ Pa in 15min

Substrate Holder

Max. Ø80mm, rotation speed 0–20 RPM (adjustable)

Sputtering Sources

2–3 × 2-inch targets; 1KW DC/mid-frequency/RF power supply

Uniformity

≤5% (Ø80mm area)

Gas Control

1–3 channels, ±1% accuracy (20 sccm max)

Control Mode

Manual button or PLC touchscreen (with safety interlocks)

Power Supply

AC220V/50Hz, 2.5KW

Dimensions (L×W×H)

500 × 360 × 380mm

Optional Upgrades: Substrate heating/cooling, dry pump, additional flow meters, water chiller.


Target Applications

· Research: Thin-film studies (metals, oxides, semiconductors).

· Education: Lab demonstrations and student projects.

· Industry: Prototyping for electronics, optics, and energy materials (e.g., ITO for solar cells).

Why PD-200C?

· Fast turnaround: Rapid pump-down accelerates experimental cycles.

· Scalable: Modular design adapts to evolving research needs.

· User-centric: Intuitive controls and safety features streamline operation.



Oxides Magnetron Sputtering

DC/RF Magnetron Sputtering

Magnetron Sputtering




PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity