Auto Magnetron Sputtering Deposition System For Thin Film Fabrication Of Semiconductor & MEMS

ItemNo :
Lith-CK300-03
MOQ :
1
Compliance:
CE Certified
Warranty:
1 year
Delivery Time:
5 days
Email :
Louis@lithmachine.com

Contact Now

Product Details

Auto Magnetron Sputtering Deposition System For Thin Film Fabrication Of Semiconductor & MEMS

Model: CK300-03 -Multi-target, Multi-film Deposition

1. Specifications

Parameter

Specification

Chamber Design

Single-chamber, vertical front-loading (stainless steel/vacuum-grade materials)

Base Vacuum

≤5×10⁻⁵ Pa

Pump-down Time

100 min (to ≤5×10⁻⁴ Pa after N² venting)

Leak Rate

≤5×10⁻⁷ Pa·L/s

Magnetron Targets

3 × 3-inch (2 standard-field, 1 high-field, DC/RF compatible, Kurt J. Lesker)

Power Supplies

1 × RF (600 W, 13.56 MHz), 2 × DC (1000 W, AE Corp.)

Substrate Stage

3-position, rotating (5–30 RPM), heated (up to 450°C), bias voltage (1000 V)

Target-Substrate Distance

40–120 mm (80–120 mm with ion source)

Gas Control

2-channel MKS mass flow controllers (Ar + reactive gases)

Film Thickness Uniformity

≤5% on 2-inch area (Cu/Al: 4–5 µm, Ni/PTFE: 1–2 µm)

Adhesion Test

Passes 3× tape test (glass, Si, ceramic substrates)

Additional Features

Reverse sputtering, anode-layer ion source, safety interlocks, computer control

2. Key Features & Benefits

✔ High-Precision Deposition

· Uniform films with ≤5% thickness variation, ideal for research and prototyping.

· Multi-layer capability (e.g., Al/Ni, Al/PTFE) with automated target switching.

✔ Advanced Process Control

· Computer-controlled deposition (temperature, rotation, gas flow).

· Ion-assisted deposition enhances film density and adhesion.

✔ Flexible & Reliable Design

· Three-target system supports diverse materials (metals, dielectrics, semiconductors).

· Substrate heating (450°C) and rotation ensure high-quality coatings.

✔ Research-Optimized Safety

· Fail-safe protections (water/power interlocks, anti-misoperation).

· Controlled environment with bake-out and contamination liners.

3. Ideal Applications

· Academic & Industrial R&D: Thin-film studies, optoelectronics, protective coatings.

· Semiconductor & MEMS: Precise metal/dielectric layers for device fabrication.

· Advanced Materials: Hard coatings (e.g., tooling), functional films (e.g., PTFE).

4. Why Choose This System?

· Repeatable results with automated workflows.

· Imported critical components (Kurt J. Lesker targets, AE power supplies) ensure reliability.

· Compact footprint with full-featured capabilities for labs.

PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity

HotTags : Thin Film Fabrication Auto PVD Coater Sputtering Deposition System MEMS Deposition System Auto Sputtering Deposition System Semiconductor Deposition System

Parameter	Specification
Chamber Design	Single-chamber, vertical front-loading (stainless steel/vacuum-grade materials)
Base Vacuum	≤5×10⁻⁵ Pa
Pump-down Time	100 min (to ≤5×10⁻⁴ Pa after N² venting)
Leak Rate	≤5×10⁻⁷ Pa·L/s
Magnetron Targets	3 × 3-inch (2 standard-field, 1 high-field, DC/RF compatible, Kurt J. Lesker)
Power Supplies	1 × RF (600 W, 13.56 MHz), 2 × DC (1000 W, AE Corp.)
Substrate Stage	3-position, rotating (5–30 RPM), heated (up to 450°C), bias voltage (1000 V)
Target-Substrate Distance	40–120 mm (80–120 mm with ion source)
Gas Control	2-channel MKS mass flow controllers (Ar + reactive gases)
Film Thickness Uniformity	≤5% on 2-inch area (Cu/Al: 4–5 µm, Ni/PTFE: 1–2 µm)
Adhesion Test	Passes 3× tape test (glass, Si, ceramic substrates)
Additional Features	Reverse sputtering, anode-layer ion source, safety interlocks, computer control