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Features
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5 magnetron sputtering guns for 5 different target materials
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Depending on the power supplies used (RF or DC), both metallic and non-metallic materials can be deposited.
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Capable of sputtering 5 target materials to produce various compositions via different sputtering times / rates
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With optional 5 power supplies, 5 target materials can be sputtered at the same time for combinatorial sputtering
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16 samples can be deposited in one batch with a mask and a rotating sample holder
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Input Power
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Single phase 220 VAC, 50 / 60 Hz
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1000 W (including vacuum pump and water chiller)
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Power Source
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One 13.5 MHz,300 W auto-match RF generator is included and connected to the sputtering heads
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The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched “in the plasma” without breaking of vacuum during a multilayer process.
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Multiple RF power supplies are optional, which allows user to sputter multi-target at the same time for combinatorial sputtering
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Laptop with control software is available at extra cost to control each RF gun's sputtering time and power
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Optional
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You may choose DC power supply for metallic target sputtering
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With five DC or RF power supplies, 5 target materials can be sputtered at the same time for combinatorial sputtering
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Magnetron Sputtering Head
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Five 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
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RF cable replacement can be purchased at TMAX
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One manually operated shutter is built on the flange (See Pic #3)
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One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
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Sputtering Target
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Target size requirement: 1" diameter x 1/8" thickness max
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Sputtering distance range: 50 – 80 mm adjustable
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Sputtering angle range: 0 – 25° adjustable
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1" diameter Cu target and Al2O3 target are included for demo testing
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Various oxide 1” sputtering targets are available upon request at extra cost
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For target-bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy (Pic #1) and extra copper backing plates (Pic #2) can be ordered at TMAX
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Vacuum Chamber
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Vacuum chamber is made of 304 stainless steel with reinforcing rib
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Inside vacuum chamber size: 470 mm L × 445 mm D × 522 mm H (~105 Liters, 18.5“x17.5"x 20.5")
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Round 380 mm Dia. hinged type door with 150 mm Dia glass window
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Temperature range: -15 to 150 °C
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Vacuum level: 4.0E-5 torr with turbo pump
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Sample Holder
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150 mm diameter rotatable sample holder for coating 16 sample one one batch with different compositions
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Sample holder and mask rotation can be controlled manually by a button or automatically by a control software (Optional)
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The sample holder temperature is adjustable from RT to 600 °C max
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Vacuum Pump
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KF40 vacuum port is built in for connecting to a vacuum pump.
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A compact turbo pump is included
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4.0E-5 Torr with optional turbo pump
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Optional
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Precision quartz thickness sensor is optional. It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required)
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Easy USB connection to PC for remote thickness and coating speed monitoring
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5 pcs quartz sensors (consumable) are included
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Net Weight
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Compliance
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CE approval
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MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote.
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Warranty
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One years limited warranty with lifetime support
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Application Notes
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This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up
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A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
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For the best film-substrate adhesion strength, please clean the substrate surface before coating:
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Ultrasonic cleaning with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
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Plasma cleaning may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
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A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys
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For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below (#3) for target-bonding
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Lith supplies single crystal substrate from A to Z
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Lith RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
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Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending tester.
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HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF generator before sample loading and target changing operations
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DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water
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Louis@lithmachine.com
+0086 15959378975
