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Compact Three Head 1" RF Plasma Magnetron Sputtering System For Non-metallic Thin Film

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Compact Three Head 1

Compact Three Head 1" RF Plasma Magnetron Sputtering System For Non-metallic Thin Film

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  • MOQ :

  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
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  • Product Details

Compact Three Head 1" RF Plasma Magnetron Sputtering System For Non-metallic Thin Film

VTC-3RF is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. DC magnetron sputtering option is available upon request for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations.


Input Power

  • Single phase 220 VAC, 50 / 60 Hz
  • 1000 W (including vacuum pump and water chiller)
  • If the voltage is 110 V, a 1500 W transformer can be ordered at TMAX.

Power Source


  • 13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads
  • Continuous working time:
    • 100W: ≤ 1 hour
    • 80W: ≤ 1.5 hours
    • 70W: ≤ 2 hours
    • 60W: ≤ 4 hours
    • 50W: ≤ 8 hours
  • Load range: 0 – 80  adjustable. Tuning range: -200j – 200j adjustable
  • The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched “in the plasma” (no breaking of vacuum and plasma during a multilayer process)
  • With a DC power supply, the coater can be easily modified into 1” DC sputtering sources for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations (Bottom left picture. Please select from the Product Options)
  • Optional 300 W auto-match RF generator is available at extra cost 


Magnetron Sputtering Head

  • Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
  • RF cable replacement can be purchased at TMAX
  • One manually operated shutter is built on the flange (See Pic #3)    
  • One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads

Sputtering Target

  • Target size requirement: 1" diameter x 1/8" thickness max
  • Sputtering distance range: 50 – 80 mm adjustable
  • Sputtering angle range: 0 – 25° adjustable 
  • 1" diameter Cu target and Al2O3 target are included for demo testing
  • Various oxide 1” sputtering targets are available upon request at extra cost
  • For target bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy (Pic #1) and extra copper backing plates (Pic #2) can be ordered at TMAX

Vacuum Chamber

  • Vacuum chamber:  256 mm OD x 238 mm ID x  276 mm Height, made of high purity quartz
  • Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring
  • Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber
  • Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking 

Sample Holder

  • Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover
  • Sample holder size: 50 mm Dia. for. 2" wafer max (See picture below)
  • Rotation speed: 1 - 10 rpm adjustable for uniform coating
  • The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller


Vacuum Pump  

  • KF40 vacuum port is built in for connecting to a vacuum pump.
  • Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump
  • 1.0E-5 Torr with optional turbo pump           


  • Precision quartz thickness sensor is optional. It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required) 
    • Easy USB connection to PC for remote thickness and coating speed monitoring
    • 5 pcs quartz sensors (consumable) are included 
    • Remote PC control of the temperature controller is optional
    • Easy USB connection to PC for remote temperature control
    • Temperature control software is included. The module is compatible with LabView
  • For DC magnetron sputtering, turbo pump is recommended (Pic #3)
  • Reactive sputtering with N2 or O2 is available with optional gas mixing control station.


  • 540 mm L x 540 mm W x 1000 mm H

Net Weight

  • 60 kg


  • CE approval
  • MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote. 



  • One years limited warranty with lifetime support 

Application Notes

  • This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up
  • A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
  • For the best film-substrate adhesion strength, please clean the substrate surface before coating:
    • Ultrasonic cleaning with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
    • Plasma cleaning may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
    • A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys
  • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below (#3) for target bonding
  • TMAX supplies single crystal substrate from A to Z 
  • TMAX RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5)
  • Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending tester.
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF generator before sample loading and target changing operations
  • DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water

Plasma Magnetron Sputtering


  1 Standard exported package: Internal anticollision protection, external export wooden box packaging.

  2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.

  3 Responsible for the damage during the shipping process, will change the damaged part for you for free.


DELIVERY TIME:15-20 days after confirming the order, detail delivery date should be decided according to 

production season and order quantity.