Compact Magnetron Sputtering System Coater With Dual 2" Target Sources
VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015. Film Thickness Monitor is not included.)
SPECIFICATIONS
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Compact Structure
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Input Power
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Single phase 220 VAC 50 / 60 Hz
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2000 W (including vacuum pump and water chiller)
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Source Power
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Two sputtering power sources are integrated into one control box
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DC source: 500 W power for coating metallic materials (Pic 1)
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RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)
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Magnetron Sputtering Head
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Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included
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One Sputting Head Model also available in this product page (in product options)
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One is connected to DC source for coating metallic materials
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The other one is connected to RF source for non-conductive materials
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Target size requirement: 2" diameter
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Thickness range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)
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One Stainless Steel Target target and one Research Grade Al2O3 target are included for demo testing
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Optional 2" sputtering targets (or backing plate) are available upon request at extra cost.
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Recommended Sputtering Recipe and Useful Tips
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Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
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Optional: 148 cm RF cable can be ordered at extra cost for replacement (Click the 1st pic from right to order)
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Vacuum Chamber
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Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
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Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
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Hinged type lid with pneumatic power pole allows easy target change
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Sample Stage
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Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
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Sample holder size: 140 mm Dia. for. 4" wafer max
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Rotation speed: 1 - 20 rpm adjustable for uniform coating
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The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
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Gas Flow Control
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Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses
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Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
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Air inlet valve is installed for vacuum release
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Vacuum Pump Station
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A mobile pump station is included. The sputtering coater can be placed on top of station
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High-speed turbo pump at speed 80L/S is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
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Standard vacuum level connected with chamber : < 4.0E-5 Torr. . (1.0E-6 Torr with chamber baking )
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Optional at extra cost
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If choose a 150L/S high speed turbo pump, vacuum can reach 10-6 torr with chamber ( 6x10-7 torr with baking)
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For the ultra-high vacuum upto 10^-7 torr, a getter pump (100L/s H2 & O2) is needed in addition to the turbo pump. Please consult our engineers for detailed customization.
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Water Chiller
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One digital temperature controlled recirculating water chiller is included.
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Refrigeration range: 5~35 °C
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Flow rate: 16 L/min
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Pump pressure: 14 psi
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Optional
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Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
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Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at extra cost
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Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI
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Overall Dimensions
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Net Weight of Coater
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Shipping Weight & Dimensions
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Total 2 Pallets
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#1: 520 lbs, 52" x 40" x 50"
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#2: 420 lbs, 48" x 40" x 45"
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Compliance
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CE approval
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MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote.
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Warranty
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One years limited warranty with lifetime support
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Application Notes
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A two-stage pressure regulator (not included) should be installed on gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
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In order to remove oxygen from the chamber, we suggest you to use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce oxygen level to < 10 ppm
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Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in.
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For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding
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TMAX supplies single crystal substrate from A to Z
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TMAX Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
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Test the flexibility of the thin film / coated electrode with EQ-MBT-12-LD mandrel bending tester.
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HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
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DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water
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PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damaged part for you for free.
DELIVERY TIME:15-20 days after confirming the order, detail delivery date should be decided according to
production season and order quantity.
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ONLINE
Louis@lithmachine.com
+0086 15959378975
