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High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition

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  • Tel : +86 18659217588
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High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition

High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition

  • ItemNo :

    Lith-ETD-100AF
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

High Vacuum Thermal Evaporation Coater Evaporator System For High-Purity Metal Film Deposition



Model:  ETD-100AF-High Vacuum Thermal Evaporation


Technical Specifications

Parameter

Specification

Evaporation Current

Max 100 A

Evaporation Voltage

Max 10 V

Heating Power

1,000 W

Chamber Size

Ø230 mm × 280 mm (H)

Working Vacuum

2×10−3 Pa

Ultimate Vacuum

2×10−4 Pa

Target Materials

Carbon, gold & other low-melting metals

Pumping System

Mechanical pump (primary) + Turbo molecular pump (secondary)


Key Features

✔ High Vacuum & Fast Deposition

· Advanced compound molecular pump ensures rapid gas evacuation for clean, efficient coating.

· Minimized oil backflow for contamination-free operation.

✔ Reliable & Efficient

· Resistive heating technology for stable evaporation of low-melting metals.

· Simple process with high deposition rates, ideal for lab-scale production.

✔ User-Friendly Design

· Compact chamber accommodates diverse sample sizes (up to Ø230 mm).

· Low maintenance costs for routine use in R&D and academia.


1. Non-Damaging Deposition

· Thermal Evaporation: Gentle heating avoids high-energy plasma, ideal for sensitive samples (e.g., polymers, biomaterials).

· Sputtering Risk: Energetic ions in sputtering may alter delicate surfaces.

2. Faster & Cleaner for Pure Metals

· Higher Deposition Rate: Rapid vaporization of metals (e.g., Au, C) reduces coating time.

· Sputtering Limitation: Slower for low-melting-point materials due to target cooling needs.

3. Minimal Sample Charging

· Uniform Conductive Layers: Smooth metal films (e.g., 5–10 nm Au) prevent SEM charging effectively.

· Sputtering Consideration: Sputtered films may exhibit grainier surfaces, affecting conductivity.

4. Lower Equipment Complexity

· No Gas/Plasma System: Simpler operation and maintenance vs. sputtering’s gas flow/power controls.

· Cost-Effective: Lower power consumption and consumable costs (e.g., replaceable tungsten boats).


Recommended Applications

· SEM Sample Preparation: Conductive coatings for non-conductive or beam-sensitive materials.

· Thin-Film Research: Rapid prototyping of pure metal films (Au, Ag, Al).

· Industrial R&D: Process optimization for specialty coatings.

Ideal For

· Microscopy Labs – Prevents charging in non-conductive samples.

· Material Scientists – Electrode fabrication & conductivity studies.

· Universities – Teaching tool for vacuum deposition principles.


Thermal Evaporation System


High Vacuum Evaporator

Metal Film Evaporator




PACKAGE:
     1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
     2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
     3 Responsible for the damage during the shipping process, will change the damage part for you for free.
 

DELIVERY TIME: 15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity