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Compact Magnetron Sputtering System Coater With Dual 2" Target Sources

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  • Contact Person : Louis Yang
  • Email : Louis@lithmachine.com
  • Address : No. 5 Nanshan Road, Huli District, Xiamen City, Fujian Province, China
Compact Magnetron Sputtering System Coater With Dual 2

Compact Magnetron Sputtering System Coater With Dual 2" Target Sources

  • ItemNo :

    VTC-600-2HD-LD
  • MOQ :

    1
  • Compliance:

    CE Certified
  • Warranty:

    1 year
  • Delivery Time:

    5 days
  • Email :

    Louis@lithmachine.com
  • Product Details

Compact Magnetron Sputtering System Coater With Dual 2" Target Sources




VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015.  Film Thickness Monitor is not included.)

 

SPECIFICATIONS


Compact Structure

          


Input Power

  • Single phase 220 VAC 50 / 60 Hz
  • 2000 W (including vacuum pump and water chiller)




Source Power

  • Two sputtering power sources are integrated into one control box 
    • DC source: 500 W power for coating metallic materials (Pic 1)
    • RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)

      






Magnetron Sputtering Head

  • Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included 
  • One Sputting Head Model also available in this product page (in product options)
    • One is connected to DC source for coating metallic materials
    • The other one is connected to RF source for non-conductive materials
    • Target size requirement: 2" diameter
    • Thickness range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)
    • One Stainless Steel Target target and one Research Grade Al2O3 target are included for demo testing
    • Optional 2" sputtering targets (or backing plate) are available upon request at extra cost.
    • Recommended Sputtering Recipe and Useful Tips
  • Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
  • Optional: 148 cm RF cable can be ordered at extra cost for replacement (Click the 1st pic from right to order)

                            




Vacuum Chamber

  • Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
  • Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
  • Hinged type lid with pneumatic power pole allows easy target change

                    




Sample Stage

  • Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
  • Sample holder size: 140 mm Dia. for. 4" wafer max
  • Rotation speed: 1 - 20 rpm adjustable for uniform coating
  • The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller

                          

Gas Flow Control

  • Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses 
    • Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
  • Air inlet valve is installed for vacuum release

Vacuum Pump Station    

  • A mobile pump station is included. The sputtering coater can be placed on top of station
  • High-speed turbo pump at speed 80L/S is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
  • Standard vacuum level connected with chamber : < 4.0E-5 Torr. .  (1.0E-6 Torr with chamber baking )
  • Optional at extra cost
  • If choose a 150L/S high speed turbo pump, vacuum can reach 10-6 torr  with chamber  ( 6x10-7 torr with baking)
  • For the ultra-high vacuum upto 10^-7 torr, a getter pump (100L/s H2 & O2) is needed in addition to the turbo pump. Please consult our engineers for detailed customization.

Water Chiller

  • One digital temperature controlled recirculating water chiller is included. 
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi




Optional

  • Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
  • Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at extra cost
  • Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI

             


Overall Dimensions

                                        
      

Net Weight of Coater

  • 160 kg

Shipping Weight & Dimensions

  • Total 2 Pallets
  • #1: 520 lbs, 52" x 40" x 50"
  • #2: 420 lbs, 48" x 40" x 45"

Compliance

  • CE approval
  • MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote. 

              

Warranty

  • One years limited warranty with lifetime support

 Application Notes

  • A two-stage pressure regulator (not included) should be installed on gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
  • In order to remove oxygen from the chamber, we suggest you to use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce oxygen level to < 10 ppm
  • Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in.
  • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding 
  • TMAX supplies single crystal substrate from A to Z  
  • TMAX Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C 
  • Test the flexibility of the thin film / coated electrode with EQ-MBT-12-LD mandrel bending tester
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
  • DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water





Magnetron Sputtering System





PACKAGE:

  1 Standard exported package: Internal anticollision protection, external export wooden box packaging.

  2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.

  3 Responsible for the damage during the shipping process, will change the damaged part for you for free.

 

DELIVERY TIME:15-20 days after confirming the order, detail delivery date should be decided according to 

production season and order quantity.